Position Overview
We are seeking an experienced Substrate Layout Design Engineer to support the development of an advanced multi-die organic based flip chip module that integrates multiple dies in a chiplet format within a high-density, high-performance substrate. This role focuses on physical layout of the substrate using Siemens Xpedition tool, routing feasibility, and co-design alignment with floor planning, mechanical, and system constraints.
Additionally, design of organic based substrates for SMT attachment with multilayer ABF based stack up.
The successful candidate will collaborate closely with package integration, signal/power integrity, and system mechanical teams to ensure successful layout implementation and manufacturability for a complex multi-chip package.
Responsibilities
- Drive physical layout of high-density substrate designs for advanced multi-die packages, including planning of bump maps, netlist alignments, escape/breakout routing, via structures, and layer stack-up definition for optimum performance of signal and power connectivity.
- Assess routing feasibility in a co-design environment, considering die floorplans, netlist, IO bump placement, and mechanical constraints at both the component and system levels.
- Collaborate with system architects, packaging engineers, ASIC, SI/PI, and mechanical teams to align on floor planning strategies and package mechanical outline and structure.
- Optimize signal, power, and ground integrity through intelligent routing, layer usage, and design constraint enforcement.
- Execute DRC, DFM, and manufacturing rule checks to ensure design readiness for fabrication and assembly.
- Generate and release final design packages and interface with substrate vendors for fabrication and manufacturability.
- Support technical reviews of substrate layouts and iterate with internal and external stakeholders on design improvements for optimum performance.
Qualifications
- 8+ years of experience in advanced substrate layout for high-performance IC packaging, with direct involvement in multi-die or chiplet-based designs.
- Proven expertise in organic substrate layout with high routing density, fine-pitch bump escape, and constrained layer stack-ups.
- Experience in PCB design layout and schematic.
- Strong understanding of co-design methodology, including interactions between floorplan, substrate layout, and system mechanical boundaries.
- Proficient with Siemens Xpedition, Allegro Cadence APD, design tools.
- Familiarity with SI/PI design principles and how organic substrate layout impacts electrical performance.
- Experienced in working with OSATs or substrate suppliers for design tape-out and manufacturability validation.
- Familiarity with substrate design rules and materials, substrate manufacturing.
- Excellent communication and documentation skills.
- Bachelor or Master degree in Electrical, Mechanical, or Packaging Engineering, or equivalent.
Why Join Us?
At Eridu, you’ll have the opportunity to shape the future of AI infrastructure, working with a world-class team on groundbreaking technology that pushes the boundaries of AI performance. Your contributions will directly impact the next generation of AI infrastructure solutions, transforming the performance of AI data centers.
The starting base salary for the selected candidate will be established based on their relevant skills, experience, qualifications, work location, market trends, and the compensation of employees in comparable roles.
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