Join Customer Engineering and play a pivotal role in Intel’s transition from IDM to Foundry.
Customer Engineering is an integral part of MDCE (Manufacturing Development and Customer Engineering) which is responsible for both improving yield and performance on high volume manufacturing technologies and supporting all Intel’s customers.
Customer Engineering works with our foundry customers to ensure they receive world class service.
This job requisition seeks a fab integration Customer Engineering role in the MDCE Customer Engineering organization, reporting to a Customer Engineering manager. Selected candidates will work closely with internal teams and external customers to ensure seamless technology integration and customer satisfaction.
Customer Integration engineers' responsibilities include (but not limited to):
• Critical Responsibility will be for identifying recurring patterns and learnings from customer engagements, abstracting these into foundry standards, systemising, automating and proliferating them across other technologies and customers.
• Be the DRI (Directly Responsible Individual) to support customer improvement projects and respond to process issues on behalf of the customer. Will be responsible for regular communication with the customer and from the customer to the factory. Be the single point of contact for FEOL and/or BEOL process integration issues for customer.
• Collaborate with Technology Development team to import new technology to Customer Products.
• Work with FEOL/BEOL Integration, Device, Defect Reduction and Yield Analysis team members to identify root cause of yield/performance issues and implement mitigation plan in defined timeline to meet committed production yield/performance targets and to support fast paced yield ramp-up in high-volume manufacturing phases.
• Own engineering projects to improve product yield, quality, performance and to reduce wafer cost.
Candidate should possess the following behavioral skills:
• Problem-solving technique with strong self-initiative and self-learning capabilities. Comfortable working with a high degree of autonomy
• Ability to work with multi-functional, multi-cultural teams.
• Must be highly organised with the ability to identify patterns from customer-specific issues, abstract key learnings, and systemise and proliferate best practices across teams and technologies.
• Must demonstrate excellent communications skills and the ability to distil complex information in to easily understandable messages.
• Must possess a high degree of ownership for problems with a high tolerance for ambiguity.
• Demonstrate interpersonal skills including influencing, engaging, and motivating.
Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Minimum Qualifications:
• Bachelor's degree in Electrical Engineering, Materials Science, Physics, or related STEM field; advanced degree preferred.
• 10+ years' experience in advanced node semiconductor industry in FEOL and/or BEOL Process Integration.
• 10+ years' experience in advanced node semiconductor development or high-volume manufacturing.
Preferred Qualifications:
• Advanced degree (Master's or Ph.D.) in Electrical Engineering, Physics or Materials Science major is preferred. Other related science and engineering degrees can be considered based on industry experience.
• 7+ years of experience collaborating with module processes including lithography, dry etch, wet etch, CMP, thin films and metrology.
• 7+ years of applied industrial experience in Semiconductor process integration, device physics, logic, architecture and integration, and interconnect development on leading-edge technology nodes.
• 7+ years of: Strong project management skills with ability to manage timelines, risks, and deliverables across multiple stakeholders.
Work in 7nm-16nm FinFET
Experience with Process Design Kit (PDK) silicon model target generation and use, silicon-to-simulation correlation, test structure design, device modeling, and electrical characterization.
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $140,830.00-198,820.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.Work Model for this Role
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.*
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.intel