Advanced Packaging Technology and Manufacturing (APTM) Yield Group is looking for a Yield Analysis and Defects lead engineer to join our team tasked with the objective of driving yield and defect improvement across APTM portfolio of packaging technologies.
As a lead yield analysis and defects engineer, the successful candidate will set priorities for the team, get results across boundaries, ensure an inclusive work environment, and demonstrate progress to key yield milestones in technology development and high-volume manufacturing phases. Our job is to understand where our manufacturing processes, test content and inline metrologies need to be improved and fixed. We are looking for engineers who love solving technical problems, are driven to achieve results, and are flexible to adapt to new methods, tools, and fields of study depending on what is needed to solve the problem at hand. You will have access to extremely large datasets and the potential to become a technology expert.
Responsibilities will include:
Extract insights from structured and unstructured data by quickly synthesizing large volumes of data, applying statistical methods and machine learning techniques
Develop solutions to problems by utilizing formal education, knowledge of manufacturing process, statistical knowledge, and problem-solving tools
Independently drive recommendations and influence the Yield and defects improvement roadmap
Good understanding of the relationship between electrical and physical fails including a deep knowledge of FIFA, DFT, Sort/Test, Integration/Process Flow, Datamining, Databases, Data manipulation, and Data visualization
Good understanding of Inline Defect Metrology, detection capabilities and underlying defect systems in the factory.
Developing strong partnerships with diverse groups such as Process Engineering, Integration, QNR, and Product and Test Development Engineering.
Preparing detailed, clear, and timely reports summarizing the yield and device health. Owning determining the actions required to deliver Best in Class yield levels.
Developing solutions to problems using process, Sort/Test and inline metrology knowledge, statistical knowledge, and problem-solving skills.
Work with both upstream, downstream and cross functional key partners to ensure successful technology development, transfer and ramp of new technology into HVM.
Leading of small group of engineers in direct or indirect capacity.
Some domestic and international travel will be needed.
The candidate should also exhibit the following behavioral traits or/and skills:
Be capable of directing cross-functional teams and working effectively across organizational boundaries.
Tolerance of ambiguity and flexibility with respect to job roles and working hours.
Demonstrated skills working in a high performing team culture which includes excellent teamwork and leadership skills, demonstrated problem-solving and prioritization skills.
Excellent analytical skills and a passion for data analysis and problem-solving.
Excellent organizational skills with strong attention to detail.
Excellent interpersonal skills with the skills to work with people at all levels.
Excellent communication and presentation skills to influence and direct a wide variety of groups at all levels.
A positive can-do attitude with the willingness to lead.
Capable of working autonomously with minimal oversight or coaching.
You must possess the below requirements to be initially considered for this position. Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates.
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Minimum qualifications:
US Citizenship Required and ability to obtain and maintain an active US Government clearance.
Bachelor's degree (with 6+ years of relevant experience) OR Master's degree (with 4+ years of relevant experience) OR PhD degree (with 2+ years of relevant experience) in Materials Science and Engineering or Mechanical Engineering or Computer Science or Information Systems or Chemical Engineering or Electrical Engineering or Chemistry or Physics or any other related discipline.
5+ years of experience in data analysis through JMP, Python, or other data engineering software.
Preferred qualifications:
Active US Government clearance.
In-depth understanding and hands-on application of statistical analysis.
Demonstrated proficiency in structured technical problem-solving.
Demonstrated understanding of product design/circuit/architecture as relevant for yield analysis.
Demonstrated understanding of inline metrology capabilities as relevant for yield analysis and defect systems.
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $141,910.00-269,100.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*
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