Principal Engineer ASIC Development Engineering (Signal & Power Integrity)

Key Responsibilities

• Lead, mentor and deliver technical contributions for designing advanced high bandwidth ASIC packages.
• Conduct advanced power and signal integrity analysis for board and MCM packages.
• Provide expert design guidance for power distribution networks, collaborating with digital design, package, and board teams.
• Recommend and implement improvements to power and signal nets, enhancing overall system reliability.
• Perform circuit simulations using Hspice netlists and full-chip models.
• Develop and validate behavioral models (IBIS) for I/Os, supporting high-speed USB3/USB2 interfaces in integrated mobile platforms.
• Utilize industry-standard tools (Cadence PowerSI, 3DEFM, T2B, PowerDC, Agilent ADS, Nimbic, AllegroSIP) for analysis and design.

Required Qualifications

• Bachelor’s or Master’s degree in Electrical Engineering, Electronics, or related field.
• Familiarity and expertise with at-least one of the high speed interfaces such PCIe Gen6/7, DDR5/LPDDR5, ONFI, USB3.2/USB4 etc.
• Minimum 8–12 years of relevant experience in SI/PI analysis, board/package design, and use of modern simulation tools (Hspice, ADS, Cadence, HFSS, Siemens Advanced Solvers).
• Expertise in Power delivery network concepts and signal integrity analysis.
• Technical proficiency in S-parameter extraction, 3D modeling, system-level SI simulation, and IBIS model development.
• Programming skills in Perl, TCL, Shell, and C.
• Hands-on experience with industry-standard EDA tools (Cadence PowerSI, Agilent ADS, Allegro SIP, Ansys SIwave, Siemens Advanced Solver).
• Familiarity with CMOS process technologies and specifications of various I/Os.
• Comfortable working in Linux environments.
• Relevant certifications in SI/PI analysis, simulation tools, or hardware design (preferred).