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Die Preparation Process Development Engineering at Sandisk | Boar Signal
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Die Preparation Process Development Engineering
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Die Preparation Process Development Engineering
馃搵 Share
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馃搷 shanghai, , China
On-site
Full-time
Senior
Posted 3/13/2026
via smartrecruiters
Job Description
Die Preparation (DP) process evaluation for ASIC wafer, flip chip wafer and 3D NAND wafer assembly.
New DP process recipe development to achieve high quality product and cost down.
New DP technology evaluation and introduction.
Co-work with material/machine team with new package related material machine evaluation.
Co-work with objective owner to handle new product DP process.
About Sandisk
Sandisk
https://careers.smartrecruiters.com/Sandisk
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