Lead the company’s in-house and subcontracted Operations Engineering functions (Test, Product, Reliability Engineering), to develop and manufacture complex SoC/SiP devices on leading edge process and package technologies, for a leading provider of AI security and power management products.
- Manage product (chips and boards) technical manufacturing from introduction, to design,
- prototype, qualification, HVM production release, sustaining and supplier/customer support.
- Collaborate internally with Engineering on new product development (DFT/DFM, package design,
- ATE test HW/SW development, product qualification, characterization, yield enhancement), and
- with production planning to ensure order fulfillment and on-time delivery.
- Collaborate externally with the supply chain (fab, assembly, test, reliability/qualification, failure
- analysis yield enhancement and cost reduction).
- Support corporate quality objectives (implement scalable processes for high quality/high volume
- products, customer RMA/FA, ISO certification, … etc.)