Job Details:
Job Description:
Shape the Future of Semiconductor Innovation at Intel Foundry
Manufacturing Development Customer Engineering (MDCE) is a newly established organization within Intel Foundry TechnologyManufacturing andis focused on accelerating technologyrampand manufacturing excellence. Our mission is to seamlessly transitioncutting-edgetechnologies from development to high-volume production while making technology ramp a key competitive differentiator for Intel Foundry.
MDCE is seeking aSeniorMetals Deposition Engineertodrive world-class process performance and manufacturability for advancedmetalsdeposition modules across Intel'scutting-edgetechnology nodes (18A, Intel 3, and 12nm). This strategic role bridges Technology Development (TD), High Volume Manufacturing (HVM), and Customer Engineering, ensuring seamless module readiness from early development through full production ramp and ongoing support.
Strategic Leadership & Execution
- Align organizationalobjectiveswith technical vision and formulate strategies forcutting-edgesolution delivery
- Execute customer-first initiatives with relentless focus on meeting deadlines and requirements
- Synthesize diverse inputs to develop strategic responses and drive rapid execution of challenging schedules
Technical Problem Solving & Collaboration
- Own resolution of complex technical challenges, integrating solutions across multiple organizational groups (including technology development andhigh volumemanufacturing)
- Collaborate effectively with Technology Development (TD), manufacturing (TFSM), and Business Groups to achieve common goals
- Engage internal and external stakeholders including Integration, Device, Yield, Defect Metrology, Quality, Reliability teams, and suppliers
Team Leadership & Industry Expertise
- Define team goals, remove obstacles, and ensuretimelydelivery of process solutions
- Stay current with industry-leading technologies and direction-setting trends
- Foster in-person collaboration to accelerate decision-making and problem resolution
- Take ownership of outcomes and proactively surface and resolve issues
- Mentoring experience and ability to serve as technical focal point
- Strong ownership mindset with end-to-end problem-solving capabilities
- Ability to thrive in fast-paced, ambiguous environments whilemaintainingsafety, quality, and compliance standards
Qualifications:
The Minimum qualifications arerequiredto be initially considered for this position. Minimum qualifications listed below would be obtained through a combination of industry relevant job experience, internship experience and / or schoolwork/classes/research. The preferred qualifications are in addition to theminimumrequirements and are considered a plus factor inidentifyingtop candidates.
- Master's degree in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or related engineering/science field
- 7+ years of semiconductor manufacturing, process development, or technology development experience
- 4+ years of direct experience with metals deposition modules
- Hands onExperiencewith one or more deposition technologies:(PVD, CVD, and/or ALD technologies for metals, conductive films, or barrier/liner stacks)
- Experience in process development, optimization, and HVM transfer
- Previous semiconductor foundry experience
- Doctoral degree in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or related engineering/science field
- Previoussemiconductor foundry experience preferred
- Experience with advanced technology nodes (10nm and below), particularly Intel 18A, Intel 3, Intel 4/7, or comparable foundry nodes
- Experience with metals deposition modules including:(Contact/MOL metals (W, Co, Ru, liners/barriers,BEOL/Cu interconnect (Cu/Co/Ru/W, caps, barriers, seed,Advanced liners/barriers/adhesionlayersor conductive films)
- Technology ramp and transfer experience from TD to HVM
- Supplier collaboration experience for hardware, chamber design, or chemistry improvements
- Cross-functional leadership experience with task forces for yield improvement and technology ramp
- Experience in integration and module interactions (e.g.deposition with CMP, lithography, etch, clean)
Intel offers an exceptional opportunity to work withcutting-edgetechnology in a collaborative and innovative environment. This position provides a unique platform to shape the future of Intel's semiconductor solutions while directly supporting the company's efforts to meet diverse industry needs andmaintainleadership in high-volume manufacturing.
Join us in driving the next generation of semiconductor manufacturing excellence and advancing Intel's position as a global technology leader.
Job Type:
Experienced Hire
Shift:
Shift 1 (United States of America)
Primary Location:
US, Oregon, Hillsboro
Additional Locations:
US, Arizona, Phoenix
Business group:
Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yie