Job Details:
Job Description:
Shape the Future of Semiconductor Innovation at Intel Foundry
Manufacturing Development Customer Engineering (MDCE) is a newly established organization within Intel Foundry TechnologyManufacturing andis focused on accelerating technologyrampand manufacturing excellence. Our mission is to seamlessly transitioncutting-edgetechnologies from development to high-volume production while making technology ramp a key competitive differentiator for Intel Foundry.
MDCE isseeking a Senior Member of Technical Staff (CMP) Engineer to drive module ownership and technical leadership across Intel's most advanced logic technologies (18A, Intel 3, Intel 12nm). This role requires a seasoned professional who can navigate the complexities of process development, cross-node standardization, and high-volume manufacturing readiness while delivering exceptional results for both Intel products and foundry customers.
- Process Development & Optimization: Lead CMP process development from concept through HVM implementation across multiple advanced technology nodes
- Cross-Node Alignment: Drive standardization and best practices across Intel's technology portfolio to maximize efficiency and yield
- Problem Resolution: Own and resolve complex CMP-related yield and manufacturing issues using data-driven approaches and structured problem-solving methodologies
- Customer-Centric Delivery: Align technical strategies with customer requirements and businessobjectives, ensuring on-time delivery of robust solutions
- Technology Transfer: Bridge technology development and manufacturing teams to ensure smooth transition of CMP processes to production
- Continuous Improvement: Drive ongoing optimization initiatives to enhance process capability, yield, and manufacturing efficiency
Collaboration & Leadership
- Cross-Functional Partnership: Work closely with Integration, Device, Yield, Factory, Quality, and Customer Engineering teams
- Supplier Engagement: Collaborate with equipment and consumables suppliers to co-develop andoptimizeCMP solutions
- Team Development: Mentor junior engineers andprovidetechnical guidance across the organization
- Proven Track Record: History of significant technical accomplishments and successful project delivery
- Leadership Capability: Ability to influence and drive results across multiple organizations and disciplines
- Business Acumen: Understanding of semiconductor industry trends, manufacturing strategies, and customer requirements
- Communication Skills: Exceptional ability to communicate complex technical concepts to diverse audiences
- Adaptability: Thrives in ambiguous situations and can drive clarity in complex technical challenges while work effectively in fast-paced, high-pressure environments
- Initiative: Self-motivated with strong persistence and ability to work independently
- Quality Focus: Meticulous attention to detail with commitment to safety, quality, and compliance standards
Qualifications:
The Minimum qualifications arerequiredto be initially considered for this position. Minimum qualifications listed below would be obtained through a combination of industry relevant job experience, internship experience and / or schoolwork/classes/research. The preferred qualifications are in addition to theminimumrequirements and are considered a plus factor inidentifyingtop candidates.
- Master's degree in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or related technical field
- 7+ years of experience in semiconductor manufacturing / process development or technology development
- 4+ years of direct experience in Chemical Mechanical Planarization (CMP) process development experience with hands-on process tuning and characterization
- Experience with major CMP equipment platformsin one of the followingplatforms(AMAT, Ebara, etc.)
- Experience with CMP consumables (e.g.slurries, pads, conditioning disks, filters, clean chemistries)
- Previoussemiconductor foundry experience
- Doctoratein Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or related technical field
- Experience withadvanced technology nodes (e.g.sub-10nm logic,specificallyinGate All Around (GAA) architectureswithtrack recordof successful technology development and HVM implementation
- Cross-functional leadership experience, including task force leadership for yield improvement initiatives
- Experience with CMP integration with other process modules (e.g.deposition, lithography, etch, clean)and CMP-relevant metrology with understanding ofCMPimpacton device performance and yield.
- Experience with CMP-relevant metrology and process control (e.g.thickness, topography, defects, roughness, particles)
This role requires in-person collaboration to enable rapid decision-making and effective problem resolution.You'llwork in a dynamic, fast-pacedenvironment with competing prioritieswhilemaintainingthe highest standards for safety, quality, and customer satisfaction.
Join a team that's reshaping Intel's foundry capabilities and directlyinfluencingthe success of next-generation semiconductor technologies. This role offers exceptional opportunities for professional growth, technical leadership, andmeaningfulimpact on Intel's strategicobjectivesin the foundry market.