ESSENTIAL DUTIES AND RESPONSIBILITIES:
- To lead Die Attach Process Module Engineering team for Process/Materials Development, Qualification and Transfer to HVM.
- Responsible for Key technology development & tech-staging to drive and enable product, process and materials technology roadmap solutions for next generation memory storage packaging solutions.
- To lead or co-lead Development JET (Joint Engineering Team) with global cross-functional teams incl. process, materials, CPI, package design, thermal-mechanical simulation, quality and other related stakeholders.
- To build and nurture strong process development team related to high density ultra-thin die attach process, material and packaging architecture - emphasizing deep engineering fundamental, structured methodology and DOE planning / execution / analysis.
- To lead studies related to in-depth fundamental investigation/characterization in packaging development.
- Ensure strong materials to process/design compatibility to meet stringent quality and reliability requirements from customers and industry standards.
- To co-drive material technology roadmap definition and path finding/development programs with global cross-functional teams including product design, process engineering, lab characterization teams and test engineering in delivering Best-In-Class and Industry leading products.
- To lead and drive collaboration with strategic equipment & material suppliers, service providers, academia, industry consortium in collaboration projects or co-development activities.
- To drive breakthrough in product packaging materials and process.
- To support IR5.0 Digital Transformation for Packaging process e.g. Process Digital Twins, Advanced Process Control (APC), Fault Detection Control (FDC), fundamental lab characterization and design rules definition.
- Drive yield analysis activities in process characterization and qualification phases.
- To drive in-depth fundamental engineering investigation culture and problem-solving methodology in delivering robust packaging technology.