ROLE SUMMARY
Wire Bond Process Engineer is responsible for developing, optimizing, and sustaining wire bond processes to support new product introduction (NPI), yield improvement, and high鈥憊olume manufacturing. This role works closely with cross鈥慺unctional teams to ensure robust process capability, strong quality performance, and smooth technology transitions.
ESSENTIAL DUTIES AND RESPONSIBILITES:
- Define process windows and establish recipe baselines for Wire Bond processes using JMP DOE.
- Perform effective root cause analysis (5 Whys, DMAIC, 8D) for Wire Bond defects, equipment issues, and yield losses.
- Work closely with cross鈥憇ite Package Development teams to understand package design rules and Wire Bond requirements (pad layout, bondability, material compatibility).
- Ensure smooth transition from Development to NPI/Qualification, focusing on Wire Bond process readiness.
- Collaborate with manufacturing, equipment, and process development teams to optimize Wire Bond parameters, bonding programs, and equipment capability.
- Prepare and maintain SOP, WI, FMEA, OCAP, and Control Plan related to Wire Bond processes.
- Ensure effective handover of Wire Bond processes to production for new device/product introduction.
- Handle new material/component first article inspection (e.g., wire type, capillary, leadframe, substrate bondability).
- Drive continuous improvement in Wire Bond cost, UPH, yield, and material efficiency.
- Maintain strong process control to meet Wire Bond yield, throughput, and quality targets.
- Report Wire Bond non鈥慶onformance/customer complaints and follow through on corrective actions.