ESSENTIAL DUTIES AND RESPONSIBILITIES:
- Develops and leads SiP (System in Package) assembly and IC packaging material and processes to meet quality, reliability, cost, yield, productivity and manufacturing requirements.
- Leads new package and SMT/Flip Chip/Underfill process qualification programs.
- Develops and maintain process documentation, including standard operating procedures and work instructions.
- Plans and conducts experiments to fully characterize material and processes throughout pathfinding to development to ramp.
- Develops solutions to improve quality, reliability, cost, yield, process stability/capability, productivity utilizing statistical knowledge, and problem-solving tools.
- Establishes process control systems. Transfers process to high volume manufacturing and provide support in new factory start-up.
- Acts as a liaison with suppliers/vendors.
- Maintains product quality while developing and introducing package cost reduction programs.
- Coordinates and leads the introduction of new package processes into production.
- Collaborate with cross-functional teams to lead FC team to drive continuous improvement projects.
- Collaborate closely with process, equipment, factory automation and IT teams to deliver robust and efficient automation solutions.