ESSENTIAL DUTIES AND RESPONSIBILITIES:
- BOP (Back鈥慐nd of Process) AOI processes include SBA, Laser Marking, Laser Cutting, PKG saw and Painting development for LGA/BGA product assemblies
- Develop and optimize new BOP process recipes to achieve high capability for new products
- Collaborate with the material team on evaluation of new package鈥憆elated materials
- Work with the Packaging team on new product design, evaluation, and introduction
- Partner with the Pathfinding team to achieve leading PKG technology targets