We are seeking a highly skilled and innovative Engineer, Packaging Engineering to join our team in Batu Kawan, Malaysia. In this role, you will be responsible for developing and implementing cutting-edge packaging solutions for our semiconductor products, ensuring optimal performance and reliability.
As a Packaging Engineer, you will work in the Packaging R&D group through simulation modeling & tooling design for semiconductor packaging, flash memory product and host levels.
ESSENTIAL DUTIES AND RESPONSIBILITIES:
- Responsible for influencing package and product design by addressing structural integrity and reliability issues and advancing the technology of semiconductor packaging in general. The scope is to address all mechanical aspects of packaging technology and associated material and process interactions. The focus will be on solutions to meet increased demand for small form factor packages with thinner chips, denser interconnects, higher power, and higher reliability drives for product development and also manufacturability.
- Responsible for the modeling and simulation, design of experiment, tooling design and testing, whichever comes first for best engineering practice, of mechanical responses of IC package and flash products including solid state drives and process interactions.
- This position will interface with package & product design, electrical and physical characterization, reliability testing, failure analysis, assembly R&D and other process teams.