Job Description
Lead PCB layout for automotive HPC and chiplet platforms, delivering manufacturable designs with design teams and external suppliers. Improve efficiency through AI-enabled automation, process and library management, and team mentoring.
Key Responsibilities:
- Own multilayer/HDI placement, fine-pitch BGA escape, and routing from approved schematics and mechanical constraints through release.
- Route DDR/LPDDR, PCIe, Ethernet, and SerDes to SI/PI constraints; implement power/ground, decoupling, and thermal/EMC requirements.
- Coordinate design, SI/PI, mechanical, manufacturing teams, and external PCB suppliers on stack-ups, materials, vias, cost, reliability, and manufacturability.
- Manage footprints, pad stacks, and ECAD libraries; improve request, naming, validation, approval, versioning, traceability, reuse, and obsolescence processes.
- Lead layout/DRC and DFM/DFA/DFT reviews, resolve supplier issues, and release Gerber/ODB++, drill, stack-up, drawing, placement, and BOM data.
- Mentor layout engineers; maintain layout guidelines and checklists, and guide application notes and customer presentations explaining trade-offs and risks.
- Improve development handovers, reviews, change control, and release workflows using reusable practices, lessons learned, and supplier feedback.
- Apply AI-assisted tools and scripting to layout checks, library verification, and documentation; validate outputs, protect design data, and measure cycle-time, quality, and rework improvements.