Develop electronic hardware for automotive HPC and chiplet platforms, with a primary focus on signal integrity and power integrity (SI/PI) simulation and analysis, complemented by electronic circuit design. Drive simulation-based decisions for high-speed interfaces, power delivery, and PCB/package integration, and deliver board designs from requirements through validation.
Key Responsibilities:
- Define SoC board specifications, select components, and develop schematics and verification criteria.
- Design power, sequencing, clock/reset, and interfaces: PCIe Gen 3/4/5, LPDDR5, USB 3.x, SGMII/RGMII, and 10G Automotive Ethernet.
- Review PCB placement, routing, fabrication readiness, power budgets, thermal margins, and reliability with development/manufacturing partners
- Own SI/PI plans, budgets, and acceptance criteria; simulate DDR/LPDDR, PCIe, Ethernet, and SerDes before/after layout for loss, crosstalk, reflections, timing, jitter, eyes, and corner margins.
- Build and validate PCB/package models using 2D/3D EM extraction, S-parameters, and IBIS/IBIS-AMI; assess model quality and limitations.
- Analyze PDN IR-drop, current density, impedance, resonances, and transients; optimize power/ground structures and decoupling for rail-noise and impedance targets.
- Derive PCB/package constraints for stack-ups, materials, impedance, routing, vias, return paths, and capacitors; support EMI/EMC simulation as needed.
- Correlate simulations with oscilloscope, TDR, VNA, and rail measurements; resolve model, interconnect, PDN, and measurement discrepancies.
- Lead SI/PI reviews and verified issue closure; maintain traceable reports, reusable flows, scripts, and guidelines
- Customer document preparation (app note);