You will be responsible for technology development tasks in the assembly and packaging of advanced semiconductor packages for AI, HPC (High Performance Computing), automotive, and IoT advanced semiconductor packages (such as Flip Chip Ball Grid Array and Power Semiconductor Packages).
Ou company is driving innovation in semiconductor packaging technologies including Flip Chip, SiP, VPS, FCCSP, and FCBGA. As demand continues to grow in AI, HPC, automotive, and IoT applications, advanced packages with higher density, improved thermal performance, and greater reliability are becoming increasingly important.
To support the rapid expansion of these technologies, we are seeking experienced engineers in semiconductor assembly and packaging processes. In this role, you will contribute to the development of next-generation packages for AI/HPC, ADAS, and other advanced applications, from package design and process development to product launch. This is an excellent opportunity to work on cutting-edge semiconductor technologies and play a key role in shaping future innovations.
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