3D Design of mechatronic sub-assemblies based on precision linear motion technology, and their integration into motion control for automation tasks within semiconductor equipment
Product ownership for sub-assemblies from design to serial production: definition of requirements and functional performance characteristics, responsibility for design concepts and decisions, guiding testing and validation, as well as transition to volume production
Select, integrate, and optimize standard components from linear technology, such as linear guides and screw drives, ideally also servo motors, encoders, and cabling for wafer handling applications
Direct collaboration with global, cross-functionalteams, including hardware and software engineers, controls engineers, suppliers, and personnel from procurement and manufacturing
Conduct feasibility studies and prototype development, creation of Bill of Materials (BOMs) for production-ready models, as well as failure analysis using methodologies such as 8D
Offer design improvements for in-service sub-assemblies to reduce footprint, increase performance, simplify maintenance, and cut costs – with the goal of increasing customer value
Provide technical presentations to clearly communicate design intent, evaluation results, and validation data to customers, design teams, and management
Work closely with customers to introduce and implement the sub-assemblies into serial machines