Description

At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work — and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history.

Northrop Grumman Defense Systems in Northridge, CA is currently seeking an experienced Principal Digital Design Engineer to join the Hardware Development and Integration Team.

In this role, the Principal Digital Design Engineer will plan, generate printing circuit board (PCB) stack-ups and layouts, draw and revise components, create circuit card assembly (CCA) and fabrication drawings, and establish references and standard data for PCB design artifacts. Utilizing computer-aided design (CAD) graphic tools such as Mentor Graphics Xpedition to complete details of critical layout drawings in accordance with standard engineering drafting practices, military specifications, as well as industry standards.

You will utilize your working knowledge of digital signal processing and digital interfaces to work on FPGA and ASIC Design across the full product life cycle process.

There is no remote work for this role and the selected candidate will be required to work full-time, on-site at our facility in Northridge, CA.

Essential Duties and Responsibilities:

Layout of complex PCB’s and flex circuits, interconnect routing
Interface with electrical and mechanical engineers to work through component placement, routing, mechanical fitment for rigid, flex, and rigid-flex assemblies
Design to electrical requirements, mechanical outlines, for producibility and manufacturability
Calculate layer stack-up based on industry standards, supplier capabilities, and engineering requirements
Generate PCB, Assembly, Part Lists, and Component drawings
Creates and documents the required electronic data file outputs for fabrication and manufacturing
Understands technical theories of electrical and mechanical behavior of PCBs to influence layout decisions (i.e. impedance matching, differential pairs, strains and stresses, orientation of components, etc.)
Maintain and update CAD central libraries
Design, develop, modify and evaluate digital electronic parts, components or integrated circuitry for digital electronic equipment and other hardware systems.
Determine design approaches and parameters.
Analyze equipment to establish operating data, conduct experimental tests, and evaluate results.
Select components and equipment based on analysis of specifications and reliability.
Review vendor capability to support product development.

Basic Qualifications for Principal Digital Design Engineer: 

Bachelor's degree in STEM field with 5 years of directly related professional working experience or Master's degree in STEM field with 3 years of directly related professional working experience
Drafting and design experience of PCB layout and layer stack-up (analog, digital, RF, mixed signal topologies)
Knowledge of industry specifications and design for manufacturing (DFM) rules for CCA and PCB design, fabrication and manufacturing
Familiar with PCB design rules and techniques for CCA’s with >20 layers count from initial prototype to production.
Ability to obtain a US Government DoW Secret security clearance

Preferred Qualifications for Principal Digital Design Engineer:   

Advanced degree in STEM field
Active US Government DoW Secret security clearance
Knowledge of EDA tools package such as Mentor Graphics Xpedition.
Experience with MIL-STD compliant designs that meet reliability and maintainability requirements.
Experience in mixed signal CCA’s product design, development and system level integration.
Experience with electronic packaging / mechanical design for airborne and space applications

Primary Level Salary Range: $125,300.00 - $187,900.00

The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the position and the candidate's experience, education, skills and current market conditions.

Depending on the position, employees may be eligible for overtime, shift differential, and a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business.

The application period for the job is estimated to be 20 days from the job posting date. However, this timeline may be shortened or extended depending on business needs and the availability of qualified candidates.

Northrop Grumman is an Equal Opportunity Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO and pay transparency statement, please visit http://www.northropgrumman.com/EEO. U.S. Citizenship is required for all positions with a government clearance and certain other restricted positions.

Principal Digital Design Engineer (AHT)

About the role

Description