SMT Process programming and optimization
1.Develop, create, validate, and release machine programs for Solder Paste Printing (SPP), SPI, Pick & Place, Reflow Oven, and AOI.
2.Optimize stencil, printing, placement, thermal profile, and inspection parameters to achieve process capability targets.
3.Analyze and reduce cycle time, changeover time, and setup losses through continuous improvement initiatives.
4.Standardize program creation and validation processes across all SMT equipment
Process Ownership & Standardization
1.Define, implement, and maintain SOPs, work instructions, control plans, and process standards for SMT operations
2.Establish control limits for paste height, volume, offset, placement accuracy, oven profile, and AOI criteria
3.Monitor process compliance through periodic audits and process confirmations.
4.Review and update process documentation based on lessons learned and engineering changes
Quality & Defect reduction
1.Monitor and improve solder paste deposition quality through SPI data analysis.
2.Analyze and eliminate SMT defects such as insufficient solder, excess solder, bridging, tombstone, skew, missing components, lifted leads, solder balls, and polarity errors.
3.Validate solder joint quality through AOI and continuous defect trend monitoring
4.Lead 8D, 5 Why, Fishbone, and PFMEA activities to prevent recurrence of quality issues
Machine Performance & Productivity Improvement
1.Monitor SMT equipment utilization, downtime and throughput performance.
2.Drive corrective actions for recurring machine stoppages and process interruptions.
3.Coordinate with maintenance teams for preventive maintenance, calibration, and breakdown reduction.
4.Implement predictive and preventive measures to improve machine reliability.
New Product Introduction (NPI)
1.Review Gerber files, BOM, Pick and Place data, stencil design, and PCB layout for manufacturability.
2.Conduct DFM/DFA reviews for SMT feasibility.
3.Execute pilot builds, process validation, thermal profiling, and AOI library creation.
4.Drive smooth product launch with optimized process settings from Day 1.
Process Engineering & Continuous Improvement
1.Conduct cycle-time analysis and reduce bottlenecks in SMT line.
2.Drive continuous improvement initiatives such as Kaizen, lean, and waste elimination.
3.Improve CPH and utilization
4.Implement Industry 4.0 and data-driven process monitoring solutions.
Training & Skill Development
1.Train operators on SPP, SPI, Pick & Place, Reflow, and AOI operations.
2. Conduct skill assessments, certification, and refresher training
HSE and Safety Compliance
1. Ensure safe working conditions in SMT areas as per HSE standards
2.Conduct HIRA and risk assessments for SMT equipment and processes
3.Promote safe handling of solder paste, chemicals, and ESD- sensitive components.