Who We Are
Applied Materials is the global leader in materials science and engineering solutions that are at the foundation of virtually every new semiconductor chip and advanced display in the world. The equipment that we create and service is essential to advancing AI and accelerating the commercialization of next-generation semiconductor chips. Join us and push the boundaries of materials science and engineering in a company at the foundation of the electronics industry. The work we do together advances the world’s technology.
What We Offer
Location:
Hwaseong-Lucestar,KORYou’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more.
At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits.
As a Process Support Engineer (PSE), you'll play a critical role in guiding products through their entire lifecycle, from initial concept to final qualification. You will provide high-visibility customer support through on-site installations, system diagnoses, and the service and repair of complex systems and equipment. PSEs work closely with customers and R&D teams to develop leading-edge processes used to manufacture advanced semiconductor chips, and create hypothesis experiments and design of experiments (DOEs). You'll analyze data with statistics and compile reports with high-level conclusions on technically challenging process engineering experiments. Additionally, you will troubleshoot complex problems, perform root cause analyses, and resolve difficult process engineering and customer product issues. Process Support Engineers work across technologies such as: Chemical Vapor Deposition, Atomic Layer Deposition, Plasma Reactive Ion Etch, Physical Vapor Deposition, Anneal and Implant.Develop deep expertise in semiconductor advanced packaging processes and customer manufacturing flows to identify inspection challenges, technology gaps, and yield improvement opportunities, driving solutions through successful implementation.
Serve as the technical lead for Kinex Mantis-D Integrated Module Inspection systems, including advanced macro optical inspection applications for HBM, 2.5D/3D packaging, Hybrid Bonding, and next-generation package integration technologies.
Lead customer evaluations, demos, beta-site activities, process qualifications, and proof-of-concept projects, ensuring alignment with statement of work (SOW), project milestones, and customer deliverables.
Interface directly with customer engineering, process integration, yield, quality, and manufacturing teams to define inspection requirements, optimize recipes, and establish roadmap alignment.
Define and approve application deployment plans, process qualification strategies, and customer acceptance criteria for system installation and production ramp.
Develop and lead innovative inspection methodologies utilizing advanced macro optical inspection technologies, machine vision, AI-based defect classification, and integrated inspection solutions to maximize system performance and defect detection capability.
Analyze, develop, validate, and transfer new application capabilities from product division and R&D organizations to regional customer support teams, ensuring successful adoption in production environments.
Lead customer technical review meetings, technology roadmap discussions, and executive-level engagements related to package inspection strategy and manufacturing requirements.
Collaborate closely with global product engineering, marketing, software, and hardware teams to influence product roadmap development for future packaging inspection requirements.
Support business growth initiatives by identifying customer pain points, competitive gaps, and new application opportunities within advanced packaging inspection markets.
Functional Knowledge
Demonstrates advanced expertise in semiconductor advanced packaging processes and macro optical inspection technologies, with strong understanding of defect inspection, process control, metrology, and yield enhancement methodologies.
Possesses working knowledge of related Package inspection technologies, including optical inspection, defect review, and AI-driven analytics.
Business Expertise
Understands semiconductor packaging market trends, customer technology roadmaps, and competitive inspection solutions.
Applies industry best practices to support customer manufacturing challenges while contributing to business expansion and market share growth.
Maintains awareness of industry developments in HBM, AI packaging, hybrid bonding, chiplet integration, and advanced package manufacturing.
Leadership
Acts as a technical mentor and subject matter expert for regional and global application teams.
Leads cross-functional project teams supporting complex customer engagements and strategic technology programs.
Provides technical leadership during customer escalations, production ramp activities, and critical business opportunities.
Problem Solving
Solves highly complex inspection and process challenges by integrating knowledge of package manufacturing, optical inspection technologies, software algorithms, and customer production requirements.
Analyzes multiple sources of technical and manufacturing data to identify root causes, recommend solutions, and improve inspection effectiveness.
Develops innovative approaches to address emerging inspection challenges in next-generation advanced packaging applications.
Impact
Directly impacts customer yield improvement, quality control effectiveness, production ramp success, and overall business growth.
Influences product strategy, application development priorities, and customer adoption of advanced inspection technologies.
Supports strategic customer accounts through successful deployment of inspection solutions and achievement of factory production targets.
Interpersonal Skills
Communicates complex technical concepts effectively to engineers, managers, executives, and customers.
Builds consensus among cross-functional organizations and customer stakeholders to drive project success.
Demonstrates strong presentation, negotiation, and customer engagement skills in global environments.
Requirements
6+ years of experience in semiconductor manufacturing, inspection, metrology, yield engineering, or advanced packaging technologies.
Strong knowledge of semiconductor package processes, including HBM, hybrid bonding, chiplet integration, wafer-level packaging, and advanced substrate technologies.
Hands-on experience with optical inspection systems, machine vision applications, defect inspection methodologies, or process control solutions.
Experience leading customer-facing technical projects, evaluations, and production qualifications.
Knowledge of semiconductor inspection technologies such as optical inspection, defect review, metrology, or related systems.
Strong project management, technical leadership, and problem-solving skills.
Excellent English communication and presentation skills.
Ability to travel internationally as needed (20~30%).
Additional Information
Time Type:
Full timeEmployee Type:
Assignee / RegularTravel:
Relocation Eligible:
NoApplied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.