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Location
Singapore
Department
Technology Development (TD) - Yield Enhancement (YE) Laboratory
Project Title
Advanced Sample Preparation and AI-Enabled Process Innovation for Transmission Electron Microscopy (TEM) Analysis
Project Description
This internship provides an opportunity to gain hands-on experience in advanced semiconductor failure analysis and characterization techniques within the Yield Enhancement Laboratory. The intern will participate in a structured learning project focused on preparing semiconductor samples for Transmission Electron Microscopy (TEM) analysis using Dual Beam Focused Ion Beam (FIB) systems and complementary sample preparation techniques.
Working alongside experienced engineers and technical mentors, the intern will contribute to projects that explore innovative sample preparation methodologies, process optimization strategies, and Artificial Intelligence (AI)-Enabled approaches that improve efficiency and data-driven decision making. The internship will provide exposure to cutting-edge semiconductor technology development activities and advanced analytical workflows.
Objective of the Project
The objective of this project is to:
- Develop practical knowledge of advanced semiconductor sample preparation techniques.
- Learn the principles and applications of Focused Ion Beam (FIB) and Transmission Electron Microscopy (TEM).
- Explore opportunities to improve sample preparation methodologies through innovative engineering solutions.
- Evaluate the application of Artificial Intelligence, Generative AI, AI Assistants, or other AI-Enabled tools to enhance laboratory workflows and process efficiency.
- Build technical, analytical, and professional competencies relevant to semiconductor technology development.
Opportunities for Full Time Employment
High-performing interns may be considered for future internship or full-time employment opportunities based on business needs, individual performance, and available openings.
Project Scope
The intern will participate in the following project activities:
- Learn and apply FIB-based sample preparation techniques under appropriate technical guidance.
- Prepare semiconductor samples for TEM characterization using Dual Beam FIB systems and complementary preparation methods such as micro-cleaving, polishing, and ion etching.
- Collaborate with engineering stakeholders to understand characterization objectives and sample requirements.
- Investigate advanced FIB methodologies for emerging technology development challenges.
- Participate in projects focused on improving sample preparation effectiveness, consistency, and turnaround time.
- Explore the use of Artificial Intelligence, Large Language Models (LLMs), Agentic AI solutions, AI Assistants, or data-driven approaches to identify process improvement opportunities.
- Contribute ideas for laboratory process enhancements, documentation quality improvements, and safe work practices.
- Document project observations, technical learnings, and recommendations for future development activities.
Learning Opportunities
Through this internship, the intern will have opportunities to:
- Understand semiconductor technology development and yield enhancement methodologies.
- Gain exposure to advanced materials characterization techniques.
- Develop knowledge of Focused Ion Beam (FIB) operation principles and applications.
- Learn Transmission Electron Microscopy sample preparation fundamentals.
- Participate in engineering problem-solving and process improvement activities.
- Build experience in technical communication, project documentation, and presentation skills.
- Explore the application of AI-Enabled technologies in engineering and laboratory environments.
- Develop cross-functional collaboration skills through engagement<