Academic Internship in Materials Engineering, Mechanical Engineering, Physical Engineering, Polymer Engineering or Chemistry (f/m/div.)

Your contribution to something big:

- Topic: Investigation of Cu-pillar Underfill for Semiconductor Applications.

1. State-of-the-art Review of Underfill in the semiconductor industry;
2. Identification of  relevant material properties and influence on reliability;
3. Material Characterization (Thermal analysis, Rheology, Chemical analysis, DMA and TMA);
4. Shear/adhesion strength method implementation in Bosch BrgP;
5. Definition of test method for Nano-identation measurements in Bosch BrgP. 

These tasks are planeed to be conducted collaboratively, both within Bosch BrgP's laboratory and production environments, and at University of Minho for further testing  (e.g., DMA, TMA).