Location: Leuven (Belgium), Grenoble (France), Nice (France) or remote
About Us:
Vertical Compute is an early-stage deep tech startup dedicated to pioneering next-generation memory technologies for advanced computing architecture. Our mission is to redefine the well-known trade-offs of semiconductor memory devices, ultimately enabling the future of computing. We are welcoming passionate, experienced, and forward-thinking colleagues to join our dynamic team and disrupt the industry together.
About What You Will Do:
We are seeking a 3D Integration / Chiplet Expert to define and implement 2.5D/3D advanced packaging solutions for our Vertical Integrated Memory (VIM) technology. You will collaborate across teams to define optimal interconnect strategies and die stacking approaches to enable high-bandwidth, low-power operation.
Key Responsibilities:
Integration Architecture & Process Definition:
Develop and define architectures for 2.5D/3D stacking and heterogeneous integration of VIM dies. Work with design and technology teams to develop interconnect solutions that ensure high bandwidth and low latency.
Performance Analysis & Simulation:
Conduct multi-physics simulations (thermal, electrical, mechanical) to analyze and optimize the performance and reliability of integrated systems.
Collaboration & Communication:
Partner closely with design, process engineering, metrology, and system architecture teams. Participate in conferences, standardization bodies and industry events to promote or lead discussions about the future of chiplet integration.
Technical Leadership:
Provide technical leadership and project management guidance to multidisciplinary teams.