The Senior Process Engineer – SMT is responsible for leading, optimizing, and continuously improving Surface Mount Technology (SMT) manufacturing processes within a high-mix, high-reliability electronics production environment.
The position requires deep technical ownership of solder paste printing, placement accuracy, thermal profiling, inspection systems, and line balancing. The Senior Process Engineer acts as the technical authority for SMT operations and plays a key role in New Product Introduction (NPI), cost reduction initiatives, and equipment investment decisions.
Own local end-to-end SMT process performance including stencil printing, SPI, pick-and-place, reflow, AOI, and X-ray inspection.
Lead advanced yield improvement programs targeting complex soldering defects and placement challenges
Develop and validate process parameters including stencil design, solder paste selection, placement optimization, and reflow thermal profiling.
Lead NPI activities including PFMEA, Control Plans, line qualification (IQ/OQ/PQ), and pilot builds.
Drive systematic defect reduction for tombstoning, solder bridging, head-in-pillow, voiding, insufficient solder, and misalignment.
Analyze production data (FPY, DPMO, OEE, downtime) and lead structured problem-solving initiatives using DMAIC and 8D methodologies.
Support capital equipment selection, line layout optimization, and automation projects.
Mentor junior engineers and provide technical guidance to technicians and operators.
Collaborate with Quality, R&D, and Supply Chain to ensure DFM compliance and stable production ramp-up.