PCB Design – Create and validate multilayer PCB layouts for high-voltage systems, primarily for automotive power modules (e.g., OBC, DCDC, CCON, and other charger/converter topologies).
Schematic & Layout Design – Generate schematics and execute complex component placement and routing, ensuring compliance with high-voltage isolation, creepage/clearance requirements, impedance control, and power‑module‑specific layout rules.
Signal & Power Integrity – Analyze and simulate layout characteristics to ensure signal integrity, optimize power distribution network (PDN), minimize loop area, control switching noise, and mitigate EMI/EMC issues.
Magnetics Integration – Manage PCB layout and routing for magnetic components (transformers, inductors), optimize trace routing between magnetics and power switches, and reduce leakage inductance and power losses.
Manufacturing Support – Generate manufacturing and assembly data packages (e.g., Gerber files), collaborate with fabrication and assembly partners to ensure Design for Manufacturing (DFM) and Design for Testing (DFT). Create and maintain component footprints.
Team Collaboration – Work closely with electrical engineers (hardware) and mechanical engineers to translate requirements into final PCB designs, with special attention to thermal management, housing integration, and board outline/shape.
Verification & Review – Lead and participate in design reviews to ensure compliance with specifications, safety standards (e.g., IEC 60664), industry standards (e.g., IPC), and internal best practices.
职责描述：
PCB设计：创建并验证用于高压系统的多层PCB布局，主要面向汽车电源模块（如 OBC、DCDC、CCON 等充电与变换器拓扑）。
原理图与布局设计：根据原理图完成复杂的元器件布局和布线，确保符合高压隔离、安规间距、阻抗控制及电源模块特有的布局要求。
信号与电源完整性：分析和仿真布局特性，优化电源分配网络（PDN），减小环路面积，控制开关噪声，并减轻 EMI/EMC 问题。
磁件集成：负责变压器、电感等磁性元件在 PCB 上的布局与布线，优化磁件与功率管的走线，减小漏感和损耗。
制造支持：生成制造和装配数据包（如 Gerber 文件），并与制造和装配伙伴协作，确保设计的可制造性（DFM）和可测试性（DFT）。负责元器件封装的建立与维护。
团队协作：与电气工程师（硬件）、机械工程师紧密合作，将需求转化为最终的 PCB 设计，尤其关注散热结构、壳体配合与板形设计。
验证与评审：主导并参与设计评审，确保设计符合规范、安规标准（如 IEC 60664）、行业标准（如 IPC）及内部最佳实践。