We are seeking a Die Preparation (DP) Technician to support semiconductor backend and R&D activities through high‑quality die preparation processes, including wafer dicing and back grinding. This role is essential to ensuring die quality, yield, and readiness for downstream assembly, packaging, and engineering evaluation.
The position works closely with process engineering, package development, manufacturing, and R&D teams in a cleanroom and lab environment.
- Perform die preparation processes, including:
- Wafer dicing (blade and/or laser, as applicable)
- Back grinding / wafer thinning
- Set up, operate, and monitor DP tools and equipment according to defined process specifications.
- Inspect wafers and dies for process quality and defects, and report abnormalities.
- Support process development, optimization, and troubleshooting activities.
- Maintain process documentation, logs, and sample traceability.
- Perform routine tool checks, basic maintenance, and housekeeping.
- Collaborate with process, package, and manufacturing engineers to support development and production needs.