ESSENTIAL DUTIES AND RESPONSIBILITIES:
- Lead Product Engineering strategy: Define and execute the long-term vision for front-end (wafer) test coverage, focusing on high I/O parallelism and low-latency solutions.
- Drive strategic planning: Proactively develop long-range initiatives aligned with company goals to achieve best-in-class yield, quality, reliability, and cost efficiency.
- Innovate through DFT/DFD: Champion disruptive design-for-test and design-for-debug methodologies to enhance coverage and optimize test cost; collaborate closely with memory technology experts.
- Provide global technical leadership: Oversee wafer test development from NPI through mass production across multiple geographies within Product and Test Engineering.
- Partner with TE and ATE vendors: Align hardware solutions with organizational requirements and maintain strong vendor relationships.
- Develop scalable test programs: Design for Manufacturability (DFM) mindset, creating flexible/reliable hardware and software test infrastructure to reduce CapEx for new designs.
- Lead failure analysis: Investigate qualification and yield issues during NPI, identify root causes, and implement corrective actions to improve coverage and process robustness.
- Data Analytics: Transform test data into actionable insights for design and manufacturing teams to enhance product quality and yield.
- Mentor and influence: Guide peers, lead technical reviews, and serve as a recognized subject-matter expert.