ESSENTIAL DUTIES AND RESPONSIBILITIES:
- 3D NAND test solution design, assessment, development, and maintenance, including hardware, software, and data analysis.
- R&D and MP program development on multiple platforms including Advantest T5773, T5831 series, & In house designed platforms.
- Test Equipment bring-up and correlation for new packages, including DSA design, pin & channel mapping.
- Product-specific flow creation and integration to meet HVM requirements.
- R&D activities from pre-silicon to post-silicon, including Design Validation, Engineering Evaluation, Qualification Support, and Failure Analysis.
- Engineering investigation and resolution on design/process/packaging issues.
- RMA failure mode analysis and screen coverage improvements.
- Test data correlation between platforms. Yield enhancement and test time optimization.
- Collaboration internally across multiple departments, such as PE, Device, Packaging, and Design, as well as with external ATE vendors and related parties for debugging and related engineering activities.
- In-house designed platform and new test equipment validation, production environment setup.