During your thesis, you will perform optical and FEM simulations to calculate the transmission of light through silicon wafers.
Based on the simulation results you will develop an optical wafer inspection strategy.
You will compare the simulation results with measurements on laser-treated wafers and identify relevant correlations.
Furthermore, you will collaborate on the setup of a new imaging stage for micrometer-level stress measurement in depth and on the surface.
The experimental correlation with other stress measurement strategies to characterize the optical measurement device also falls within your area of responsibility.