2026/02: HW Developer for Electronic Control Unit

Hardware Design Engineer – LV/HV Power Electronics & Inverters

Role Summary

Responsible for the end-to-end design and development of low-voltage and high-voltage power electronics hardware, including DC/DC converters and low-power inverter systems, covering analog/digital circuitry, simulations, PCB design support, testing, and compliance with automotive standards.

Key Responsibilities

• Design analog and digital circuits using microcontrollers, op-amps, transistor families, and mixed-signal interfaces.
• Develop low-voltage DC/DC converters and high-voltage wide-input flyback converters (multiple outputs, isolation, transformer design, feedback).
• Design B6 bridge HV inverter (1200V) using SiC MOSFETs, gate drivers, HV filter protection, thermal design, PCB stack-up and insulation.
• Perform worst-case design calculations, derating, stress and power-loss analysis.
• Conduct PSpice/LTspice simulations (time-domain, frequency-domain, Monte Carlo).
• Create schematics in Zuken CR8000/OrCAD and support PCB layout (Allegro/PADS) with considerations for EMC, PCB stack-up, PCB track characteristics, and manufacturability.
• Capture/analyze customer requirements using IBM DOORS NG and follow ASPICE processes.
• Support hardware testing, debugging (Design of experiments), and validation.
• Ensure compliance with ISO 16750, ISO 7637, CISPR 25, ISO 11452, and reinforced insulation standards (12V/24V/400-800V).

Required Skills

• Analog & mixed‑signal circuit design using MCUs, op‑amps, BJTs/MOSFETs, ADC/DAC interfaces, and standard communication interfaces (SPI, I²C, UART, CAN).
• Power electronics design experience with low‑voltage DC/DC converters and wide‑input isolated flyback converters, including magnetics, feedback, and multi‑output regulation.
• High‑voltage inverter design expertise (up to 1200 V) with SiC MOSFETs, isolated gate drivers, protection concepts, thermal design, and reinforced insulation.
• Strong analytical capability in worst‑case design, derating, stress analysis, and power‑loss/thermal calculations.
• Proficiency in circuit simulation using PSpice/LTspice for transient, AC (loop stability), and Monte‑Carlo/worst‑case analysis.
• Schematic design and PCB layout support using Zuken CR8000/OrCAD and Allegro/PADS, with focus on EMC, high‑voltage spacing, stack‑up, and manufacturability.
• Requirements engineering experience using IBM DOORS NG with adherence to ASPICE development and change‑management processes.
• Hands‑on hardware debugging and validation skills, including structured root cause analysis (DoE) and lab‑based troubleshooting.
• Knowledge of automotive standards and compliance, including ISO 16750, ISO 7637, CISPR 25, ISO 11452, and insulation requirements for 12 V/24 V/400–800 V systems.