Northrop Grumman Mission Systems is a trusted provider of mission-enabling solutions for global security. We have aĀ wide portfolio of secure, affordable, integrated, and multi-domain systems and technologies. Our differentiated battleĀ management and cyber solutions deliver timely, mission-enabling information and provide superior situational awarenessĀ and understanding to protect the U.S. and its global allies.
Northrop Grumman Mission Systems is looking for you to join our team as a Photolithography Manufacturing Engineer for our Advanced Packaging Technology Āµ-Line based in Apopka, Florida.Ā
Northrop Grummanās semiconductor foundry, packaging, integration, and test lines have unique capabilities of supporting a range of production microelectronics and providing leading-edge technology development.
The Apopka Florida wafer bumping Āµ-Line supports flip chip, 2.5D, and 3D packaging for internal and external production customers as well as emerging technology programs.Ā The line provides a range of bump compositions and processes that include photo, sputter, electro-plating, AOI, and solder-sphere transfer to support flip chip, 2.5D, and 3D packaging using 100 mm to 300mm wafers.Ā The devices supported in Apopka will also be subjected to singulation and die/wafer probe testing.
TheĀ Photolithography Manufacturing EngineerĀ will provide manufacturing and development technical support and direction on a wide range of photolithography processes and tools.
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What you will get to do:
Primary responsibility will include supporting photolithography processes and tools for resist coat, expose, develop, and associated metrology. Role will involve a broad range of lithography toolsets related to 1x manual and automated tools.
You will work closely with cross-functional teams in Process Engineering, Manufacturing, Quality, Integration, and R&D to ensure process stability, improve yield, and drive continuous improvement initiatives.
Plan and execute continuous photochemical and lithography improvement projects to increase yield, productivity, and cost effectiveness, including rework improvements.
Define and implement lithography process improvements for new technology insertion to improve process robustness and achieve technology milestones for yield, reliability, etc.
Develop new technologies across the portfolio of emerging technologies in semiconductor manufacturing, including photochemical, reticle, and lithography processes.
Gather GDS files and program/foundry information to complete mask reviews with engineers and ensure layouts meet all design rules and guidelines
Use GDS files and program/foundry information to create Apopka die drawing specific to each program for engineers, technicians, and operators to use to run product.
Mentor and train technicians on shift to support quality and delivery metrics for operations.
Execute strategic projects for improvement of sustaining operations through monitoring statistical process control (SPC) charts and disposition of out of spec material.
Drive process improvements for volume manufacturing using statistical tools, DOE techniques, data driven decision making and systematic problem-solving skills.
Support process control, planning, safety, and quality organizations to ensure the equipment meets cost, quality, safety, and reliability metrics.
Lead Root Cause and Corrective Actions troubleshooting task forces and help develop solutions that prevent recurrence for excursion incidents using 8D problem solving methodologies.
Achieve customer on-time delivery and cycle time commitments through tool qualification and OEE management with manufacturing operations.
Use Failure Mode and Effects Analysis (FMEA) to assess and mitigate risk for process changes.
Position will demand large amounts of time working in a cleanroom environment. Some lifting and standing will be required.
Support capital equipment projects through procurement, installation and release for production use
Support engineering data analysis including metrology data, ERP (SAP) data, and other in-process metrics
Coordinates with production on day-to-day activities.Ā Assists in the resolution of production workflow issues.
Support of manufacturing capacity planning optimization for the photo production lines.
Support Digital Transformation initiatives
The chosen candidate must have excellent verbal and written communication skills; a strong attention to detail; be able to multi-task in a fast-paced, dynamic, and high-visibility environment; and work well as part of a team and as an individual contributor.
Basic Qualifications for the Photolithography Manufacturing Engineer:
Preferred Qualifications:
What We Can Offer You:
Northrop Grumman provides a comprehensive benefits package and a work environment that encourages your growth and supports the mutual success of our people and our company. Northrop Grumman benefits give you the flexibility and control to choose the benefits that make the most sense for you and your family.
Your benefits will include the following: Health Plan, Savings Plan, Paid Time Off, and Additional Benefits, including Education Assistance, Training and Development, 9/80 Work Schedule (where available), and much more!
Primary Level Salary Range: $72,100.00 - $108,100.00The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the position and the candidate's experience, education, skills and current market conditions.Depending on the position, employees may be eligible for overtime, shift differential, and a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Directorngc