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Summary
The Sr. Dry Etch Equipment Engineer is responsible for driving equipment reliability, long‑term corrective actions, and performance optimization of Dry Etch toolsets in a high‑volume semiconductor manufacturing environment. This role leads systematic troubleshooting, eliminates chronic failures, improves tool health, and partners closely with Production, Process Engineering, and suppliers to support yield, cycle time, and cost‑reduction goals. The engineer provides technical leadership, drives continuous improvement, and ensures the Dry Etch area operates with high stability, quality, and efficiency.
Responsibilities:
Lead systematic, root‑cause‑driven troubleshooting to eliminate chronic failures and improve overall Dry Etch equipment reliability.
Analyze tool data, identify trends and reliability risks, and implement long‑term corrective actions that reduce unscheduled downtime.
Manage tool recovery strategies, provide accurate ETAs, and partner with Production to minimize operational impact while maintaining long‑term stability.
Own spare parts strategy, BOM accuracy, consumable health, and cost‑reduction efforts related to repairs and equipment performance.
Drive yield and scrap‑reduction initiatives by resolving equipment‑related contributors to alarms, variability, chamber matching issues, and defect excursions.
Lead Continuous Improvement Projects (CIPs) focused on equipment availability, throughput, and cycle‑time reduction; remove equipment constraints through structured improvements.
Support new tool startups and process conversions by ensuring equipment readiness, sustainable performance, and alignment with process owners.
Provide technical mentorship to technicians and junior engineers on best‑in‑class maintenance practices, failure analysis, and equipment reliability methods.
Minimum Qualifications:
Engineering degree or equivalent technical experience with strong analytical, data‑driven problem‑solving skills.
Proven ability to troubleshoot complex equipment issues using structured methodologies (SPC, FMEA, 5‑Whys, 8D, fault isolation).
Strong communication and collaboration skills with the ability to work cross‑functionally and manage priorities in a fast‑paced environment.
Preferred Qualifications:
Experience with Dry Etch equipment engineering, including chamber matching, reliability improvement, and tool stability programs.
Experience driving yield, scrap, and defect‑reduction efforts in semiconductor manufacturing.
Background supporting tool conversions, new technology introductions, or equipment startup and qualification.
As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.
Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.
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To learn more about Micron, please visit micron.com/careers
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