Engineer, Process Development (Core Engineering Module)

NPI Product Qualifications

• Integrate AI-assisted tool and insights into daily work to improve efficiency, quality or effectiveness. 

• Contribute to a culture of continuous improvement by identifying, testing and sharing AI-enablement enhancement within one scope of work.   

• Excellent executiononassembly process for 1st New Product Introduction (NPI) success and smooth transfer process from NPI toHigh Volume Manufacturing (HVM).

• Excellent execution of the qualification of NPI products / packages build that proliferate from the pilot products and packages according to planned timeline

• Full responsibleon supportNPI businessprocesswith processTechnical Risk Assessment (TRA),SPC,FMEA,Quality Control Plan (QCP),riskmitigationanddocumentations.

• DeliverBestInClass (BIC)yield and cost on product NPI with integration ofDesign for Manufacturing (DFM)package solution, processguidelineand design rules.

• Collaboration with cross functional team from NPI to HVM process transfer. 

• On-time execution of NPI Customer samples and Engineering Samples build for new products and packages.

Process Owner Responsible for Continuous Improvement on Process Yield, Defect Elimination and Process Characterization

• Process ownerto performon-time detection with data analysis for process yield improvement. Lead thedefectelimination and continue improvement action, with problem solvingmethodology, statisticalanalysisand integration solution decision. 

• Process ownerto developprocessrecipefor BICUnits Per Hour (UPH),conducting process characterization to define process parameters andboundary.

• Continuousdevelopin depth assembly process technical knowledge, well understand process capability/tolerance//specificationlimit, andutilizekey tools FMEA/QCP/MachineAlarm on assembly processescharacterization/development/NPI. 

• Global leader for cross team collaboration on networkBest Known Method (BKM),process recipespecificationand recipe standardization/conversion.

Technology enablement and development – Process, Material, Equipment

• Participate and support Product Roadmap, to enable key process capability and technology development to ensure packaging solution is readyprior1st Qual Silicon deliver.

• Frequent engagement with equipment and material supplier (at least interval of monthly or daily/weekly for process issues)

• Collaboration with Supplier andinvolvementSupplier Roadmap (Material/Equipment), to understand market trends and competitor’s direction, ensure key process technology and capability enablement is in-line.

• Frequent review andparticipateCompetitor Analysis, to understand market trends and competitor’s technology/capability boundary

Minimum Required Qualifications/Experience

Education

Minimum Bachelor's degree in Mechanical, Materials, Aerospace, Chemical, Electrical, Process, Semiconductor or related Engineering discipline

Experience

• Freshgraduatewithstrong passion insemiconductor engineeringisencouragedto apply. Studentholding leadership roles inanyacademic and sportcouncilwill have added advantage

• 0-2years experiencein semiconductor packaging, assembly, or process integration. 

Soft Skills & Leadership Attributes

• Excellent data analysis, statistical analysis, data interpretation skills

• Ability to make sound data-driven decisions. Prioritize and applydue-diligenceinday to daytask.

• Possess analytical andproblem-solvingskills

• Keen interest in semiconductor engineering

• Showcaseleadership experience and potential

• Strong analytical, logical, and critical thinking skills 

• Effective communicator, able to collaborate across all levels 

• Growth mindset with a passion for continuous learning 

• Internship or experience in the semiconductor industry is a plus 

• Demonstrated l