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Improvement of NSOP (NonāStick On Pad) Alarm for WB Process Early Detection
Enhance NSOP (NonāStick On Pad) detection and alarm capability in the Wire Bond (WB) process to enable early identification of bond stick failure, reduce unscheduled downtime, and prevent extended production impact due to delayed NSOP response.
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We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich lifefor all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our MicronĀ® and CrucialĀ® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities ā from the data center to the intelligent edge and across the client and mobile user experience.
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