Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Micronâs Heterogeneous Integration Group (HIG) is shaping the future of AI and accelerated computing by developing advanced memory solutions. The team focuses on designing and optimizing High Bandwidth Memory (HBM) products for AI/ML, high-performance computing (HPC), and data-centric systems, collaborating across global engineering and product teams to deliver industry-leading performance, power efficiency, and reliability.
HBM product family is growing due to high demand from industry leading semiconductor companies. As a HBM Memory Physical Design Engineer in sustaining role you will be working with teams like Design Engineering (DE), Product Engineering (PE), Process Integration (PI), Packaging and Technology Development (TD) on evaluating silicon issues seen on all the current HBM designs. You will be responsible for supporting design and development of critical analog, mixed-signal, digital block and full chip level integration from physical design and layout design perspective! This includes creating floorplans that optimize circuit placement, signal routing, and power delivery, as well as deliver block-level layouts using advanced foundry process node. You will work with a highly innovative and motivated design team using groundbreaking memory technologies to develop the most advanced HBM products!
Responsibilities
Implement layout changes to resolve issues identified on current HBM designs on silicon and drive towards a timely and efficient tapeout.
Interact with teams like DE, PE, PI and TD to understand the challenges due to process limitations and propose layout solutions to alleviate the issues.
Be proactive in identifying and flagging design issues, performance problems, and opportunities to improve design performance and reduce power consumption.
Responsible for floor plans that optimize circuit placement, signal routing, and power delivery.
Deliver block-level (analog or mixed signal) layouts using advanced foundry process node if needed.
Contribute to the development of new HBM product opportunities by assisting with the overall planning and optimization of Memory, Logic, and Analog circuits layout.
Debug and identify root causes and solutions for pre-silicon and post-silicon issues encountered in current HBM products.
Mentor new hires as needed.
Qualifications
Bachelorâs or Masterâs degree in Electrical Engineering or related field.
8+ years (BS) or 6+ years (MS) of relevant experience.
Expertise in Cadence VLE/VXL and Mentor Graphics Calibre DRC/LVS.
Strong grasp of analog layout fundamentals including matching, electro-migration, latch-up, coupling, crosstalk, IR-drop, and parasitics.
Hands-on experience crafting analog and mixed-signal layouts (e.g., sense amplifiers, LDOs, PLLs).
Preferred Qualifications
Strong verbal and written communication skills for conveying complex technical concepts.
Self-motivated great teammate who thrives in diverse environments.
Proven innovation and problem-solving in high-performance memory development, with experience in DRAM bring-up/debug and advanced packaging (TSV, hybrid bonding, interposers).
The US base salary range that Micron Technology estimates it could pay for this full-time position is:
$135,000.00 - $309,000.00 a yearAdditional compensation may include benefits, bonuses and equity.
Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target base pay for new hire salaries of the position across all US locations. Within the range, individual pay is determined by work location and additional job-related factors, including knowledge, skills, experience, tenure and relevant education or training. The pay scale is subject to change depending on business needs. Your recruiter can share more about the specific salary range for your preferred location during the hiring process.Â
Please note that the compensation details listed in US role postings reflect the base salary only, and do not include bonus, equity, or benefits.
As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future.  We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave.  Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.
Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.
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