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Work with business unit marketing and IC design teams to select the optimum package solution on cost, performance, manufacturability, and reliability for new advanced silicon node products (5nm, 3nm, 2nm and beyond)
Work with IC design, system design, package SI/PI & thermal engineering teams to design custom packages
Ensure designed packages meet CPI, SI/PI, and stringent thermal requirements (1000sW+) of advanced node cutting edge silicon products
Research, develop, and productize new materials such as TIM, build-up-film, underfill etc. in support advanced node silicon (5nm & 3/2nm) POR definition
Manage IC packaging activity from concept through development, qualification and high volume production
Be a specialist and able to define assembly BOM, process, troubleshoot, support on packaging issues on new advanced technology
Implement, fine-tune, and productize newly developed technologies into HVM
Create package design documentation and assembly instructions
Work close with QA and customers to resolve quality issues
Interface with packaging assembly and substrate suppliers for new product bring-up, qualification and production ramp
Interface with other operations functional groups such as product engineering, foundry, test, and QA
Participate in package technology development and/or other business productivity projects which have broad team impact (e.g. assembly process enhancement, new TIM material development etc.)
Interface with tier #1 external customers for custom ASIC programs or as needed for development support, quality and/or other issue resolution
Support NPI bring-up, pkg qual, and sustain support in production + multi-source activities for capacity, cost, & manufacturing flexibility needs
Job Requirements
Education: BS/MS/PHD in STEM/Material Science/Electrical/Mechanical Engineering
Experience: BS +8 years of experience or MS +6 years of experience or PhD + 3 years of experience is required
Deep understanding of signal integrity and power integrity concepts such as characteristic impedance, s-parameters (RL, IL, FEXT/NEXT etc.), power plane impedance profile requirements and optimization etc.
Strong authority on Cadence APD for custom substrate design
Hands-on expertise of advanced and new assembly processes for flipchip, MCM packages, and 2.5D for advanced node silicon products (5nm, 3/2nm and beyond)
Good understanding of materials as related to Chip Packaging Interaction (CPI)
Familiarity with wafer BEOL as related to CPI (top metal, AP, passivation, UBM, bumping etc.)
Knowledge of advanced substrate manufacturing/process is a must (e.g. SAP/mSAP, PSPI w/ Cu RDL etc.)
In depth knowledge of failure analysis techniques on advanced node silicon (5nm, 3/2nm etc.) products with ELK and MiM structures
Conceptual knowledge of package cost structure
Strong project management, communication and leadership skills
Must have knowledge of GD&T and be able to read/comprehend mechanical drawings
Good understanding of manufacturing and quality engineering fundamentals (DOE, process capability indices, etc.)
Job requirements are broad; the candidate must be able to expand and grow in multiple disciplines (manufacturing/quality, materials, electrical, thermal, and mechanical)
Track record of innovation and subject matter expertise through journal publications and/or patent awards is desired
Familiarity with advanced technologies such as 2.5D, 3DIC, glass substrate etc.
Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.
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