Principal Solutions Engineer: Integrity

This position involves delivering advanced packaging and 3DIC implementation flows for foundry and customer solutions primarily using Cadence Integrity

Job Description:

• Delivering advanced packaging and 3DIC design planning flows for foundry and customer solutions primarily using Cadence Integrity, but knowledge of Virtuoso and APD as well is desired.  

• Work in a team environment creating and implementing 3DIC reference flows and designs.

• The candidate is expected to be an advanced level user of 3DIC design planning tools, preferably Integrity.

• Floorplanning knowledge in Innovus to deliver best solutions to costumers.

Requirements:

• Complete Bachelor’s degree in Electrical or Electronics Engineering

• Experience with package design with Intergrity is desired

• Strong knowledge of advanced packaging concepts

• Must be familiar with 3Dblox design methodology. Experience in YAML language is a plus.

• Strong knowledge of 2.5D, 3DIC and stacked die technologies

• Good programming knowledge with TCL a msut

• Strong customer-facing communication and problem-solving skills

• Strong personal drive for continuous learning and expanding professional skill sets

• Excellent verbal and written communication skills in English and Portuguese.

Additional Job Details:

• Employment category: CLT.

• Employment term: 40 hours/week.

• Competitive benefits.

• Location: Av Contorno 5800, Belo Horizonte, Minas Gerais, Brazil.

Cadence is the only company that provides the expertise and tools, IP, and hardware required for the entire electronics design chain, from chip design to chip packaging to boards and to systems. We enable electronic systems and semiconductor companies to create innovative products that transform the way people live, work, and play. Our products are used in mobile, consumer, cloud datacenter, automotive, aerospace, IoT, industrial and other market segments.

For more information, access http://www.cadence.com