Field Application Engineer (FAE) Intern, China

About GlobalFoundries

GlobalFoundries (GF) is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GF makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com.

Internship Program Overview:

Our Interns & Co-ops are our entry-level talent pipeline for GF across the globe. Our goal is to provide students with a meaningful work experience that will equip them with the skills to embark on a career in the fast-paced and growing semiconductor industry after graduation. As an intern at GF, you’ll experience one-on-one mentorship, work assignments that prioritize your growth and potential, professional development opportunities, and the chance to network with executives.

Summary of Role:

GlobalFoundries is seeking a highly motivated intern to join our Field Application Engineer (FAE) team. In this role, you will support GF customers by providing technical guidance and operational service. As part of the Global Sales Organization, you will collaborate with the team to identify, qualify, and secure new business opportunities while ensuring seamless support for existing engagements.

Essential Responsibilities include:

• Act as the technical liaison for customer interactions and coordinate all technical sales activities.
• Develop tailored technical presentations and proposals to support customer evaluations of GF solutions.
• Build strong customer relationships, gather insights, and identify new business opportunities.
• Support customer readiness for mature and advanced node tapeouts, including documentation such as export control forms, IP declarations, and frame tables.
• Resolve tapeout-related issues by collaborating with internal process experts.
• Assist with customer design reviews and mock tapeouts; ensure alignment on MPW/test chip requirements prior to product design and tapeout.

Other Responsibilities:

• Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.

Required Qualifications:

• Education – Actively pursuing a master’s degree in physics/Electronics/Electrical Engineering or related field through an accredited degree program during the time of internship.
• Must have at least an overall 3.0 GPA and be in good academic standing.
• Language Fluency - English (Written & Verbal)
• Ability to work at least 20 hours per week during the internship.

Preferred Qualifications:

• Prior related internship or co-op experience
• Demonstrated prior leadership experience in the workplace, school projects, competitions, etc.
• Project management skills, i.e., the ability to innovate and execute solutions that matter; the ability to navigate ambiguity.
• Strong written and verbal communication skills
• Strong planning & organizational skills
• Excellent written and verbal communication skills.
• Effective planning and organizational abilities.
• Solid understanding of silicon processing and device physics.
• Strong analytical and technical skills

#InternshipProgramCHN