SMTS - 3D Heterogenous integration Engineer - 2.5D interposer/bridge/DTC

About GlobalFoundries:

GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com.

Summary of Role:

GlobalFoundries Advanced Packaging Lab is seeking an accomplished engineer with extensive expertise in chiplet-based system integration, specifically within 2.5D interposer/bridge and 3D heterogeneous integration technologies. This senior technical position entails end-to-end integration responsibility for advanced heterogeneous solutions, encompassing silicon, glass, and mold interposers as well as embedded silicon bridge architectures.

Essential Responsibilities: 

• Lead 2.5D/3D advanced packaging technology platforms (e.g. silicone/glass/mold interposer, silicon bridge, deep trench capacitor, etc.) integration strategy and readiness, including interface requirements and co-optimization with fabrication and assembly constraints. 
• Partner with cross-functional teams such as unit process engineers, modeling engineers, manufacturing engineers, as well as directly with the tool and material vendors for the GlobalFoundries fabs. 
• Collaborate joint development projects with partners to develop 2.5D/3D Heterogeneous Integration processes and to provide timely updates on schedule and deliverables
• Drive end-to-end process integration, interpretation of results and planning to enable new capabilities and early product prototyping across multiple programs.
• Own integration risk assessment and develop reliability strategy; drive root-cause investigation of failure modes through failure analysis and structured design of experiment.
• Promote technical innovation via patents, internal publications, and robust integration methodologies for 2.5D/3D heterogeneous integration—including silicon/glass interposer, silicon bridge, advanced interconnects, and comprehensive integration control and metrology.

Other Responsibilities: 

• Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs. 
• Participate in hiring activities. 
• Mentor and guide new hires to assume their roles and responsibilities. 
• Other duties as assigned by manager. 

Required Qualifications: 

• Education – Master’s in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, Physics, or related field from an accredited degree program. 
• MS degree with at least 10 years of prior related work experience. 
• In-depth knowledge of BEOL processes and advanced packaging integration, including RDL/UBM metallization, wafer thinning/backside processing, wafer test/probe, OSAT collaboration, and package development & assembly.
• Strong problem-solving and technical troubleshooting skills, including expertise in design of experiment, statistical analysis, and yield/reliability learning.
• Demonstrated record of technical leadership, strong execution, and ability to influence across functions (fab, design, product engineering, reliability, and external partners). 
• Language Fluency - English (Written & Verbal). 
• Travel - Up to 10%. 

Preferred Qualifications: 

• Education – PhD education level preferred with at least 8 years of prior related work experience. 
• Demonstrated prior leadership experience in the workplace, school projects, competitions, etc.  
• Project management skills, i.e. the ability to innovate and execute on solutions that matter; the ability to navigate ambiguity.   
• Strong written and verbal communication skills.   
• Strong planning & organizational skills. 

Expected Salary Range

$118,000.00 - $210,000.00

The exact Salary will be determined based on qualifications, experience and location.