Born at X, Google's Moonshot Factory, Taara is on a mission to connect billions of people who lack abundant and affordable internet by pioneering high-throughput, long-range free-space optical communication (FSOC). Our links use eye-safe lasers propagating between two terminals to transmit high-speed data wirelessly. Lead the charge in bringing our groundbreaking wireless optical communication to the world. Join us to light the way toward bridging the digital divide and illuminating the future.
Taara is seeking a Senior Photonic Packaging Design Engineer to work on next-generation photonic integrated modules as part of the R&D team developing cutting-edge wireless optical communication systems based on integrated optical phased arrays.
The successful candidate will own the design and implementation of micro-optic assemblies of Si photonic and III-V dies at outsourced semiconductor assembly and test (OSAT) vendors. The role requires deep expertise in the modeling, optimization, assembly, and testing of photonic packaging. In particular, the candidate must demonstrate extensive commercial experience in micro-lens-based packaging design, III-V thermal management, thermo-optical package modeling, Si photonic coupling, and optimization for manufacturability and reliability.
We are looking for a highly motivated individual who thrives in ambiguity, enjoys working in a small, dynamic team environment, and possesses a passion for solving challenging problems that lead to high-impact technological advances.
Own and deliver record-breaking photonic packaging optimized for manufacturability and reliability.
Contribute to system-level optimization and product strategy.
Demonstrate strong motivation to make the world a better place through technology and a desire to be part of the team making this happen.
Ph.D. in Materials Science, Electrical Engineering, Chemical Engineering, Applied Physics, or a related field.
Five (5) or more years of relevant industry experience with demonstrated achievements in photonic packaging design.
Extensive expertise in micro-lens design for III-V and Si photonic packaging.
Expertise in thermo-mechanical package modeling and III-V thermal management.
Experience optimizing packaging for manufacturability and reliability.
Experience with optical simulation software (Zemax, Lumerical, Flexcompute, or equivalent).
Experience with thermo-mechanical simulations (Ansys, Altair, Siemens, or equivalent).
Experience working with outsourced semiconductor assembly and test (OSAT) vendors.
Experience with failure analysis, parts inspection, and testing.
Experience with microelectronic assembly processes, such as 3D and 2.5D assemblies.
Experience with solder reflow and troubleshooting solder brittleness and joint reliability.
Excellent communication and presentation skills, with the ability to work effectively with senior external partners.
Hands-on experience advancing a product from the prototype phase to the final production stage.
Hybrid/Onsite in Sunnyvale, CA is preferred. Relocation assistance can be provided.
The US base salary range for this full-time position is $220,000 - $270,000 (inclusive of bonus at target) + equity + benefits. Our salary ranges are determined by role, level, and location. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific salary range for your location during the hiring process.
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