Who You’ll Work With
Working closely with cross-functional teams including Hardware Design, Signal Integrity (SI), Power Integrity (PI), Mechanical Engineering, Thermal Engineering, and Manufacturing, our engineers innovate on system architectures and ultra-high-speed PCB designs to deliver state-of- the-art networking platforms.
What You'll Do
Our Hardware Design Engineering team is at the forefront of developing high-speed networking and Ethernet products used in enterprise campuses, hyperscale datacenters, and next-generation AI clusters. The team is responsible for end-to-end design and development of advanced hardware solutions that meet the demands of modern networking environments — including optical interface platforms up to 800G and 1.6T.
Core Responsibilities
High-Speed Layout & Routing
- Implement complex routing for advanced interfaces such as 112G/224G SerDes, PCIe Gen 5/6, DDR4/5/6
- Design and route high-speed differential pairs with tight skew and impedance control
- Execute dense BGA fan-out for high-pin-count ASICs and FPGAs
Optical Transceiver PCB Layout (800G / 1.6T)
- Design and layout boards supporting high-bandwidth optical transceivers (QSFP-DD, OSFP, OSFP-XD or equivalent)
- Route 112G / 224G PAM4 electrical channels between switch ASICs and optical modules
- Define insertion loss budgets and coordinate with SI engineers to meet IEEE compliance requirements
- Optimize breakout routing beneath high-density optical cages
- Implement via stub mitigation strategies including backdrilling for ultra-high-speed signal paths
- Manage ground reference continuity, EMI control, and return path integrity near optical connectors
- Consider thermal dissipation (20W–30W+ modules) in layout planning
Impedance Control & Signal Integrity
- Design advanced multi-layer stack-ups (20–30+ layers)
- Calculate impedance profiles and ensure low-reflection, low-crosstalk performance
- Collaborate with SI teams on channel modeling and pre-/post-layout simulations
Power Integrity (PI) Optimization
- Design robust Power Distribution Networks (PDNs) for high-current ASICs
- Layout multi-phase DC/DC converters for high transient loads
- Strategically place decoupling capacitors to ensure wideband impedance stability
Thermal & Mechanical Coordination
- Integrate thermal vias, heat sink attachments, and high-conductivity materials
- Coordinate mechanical constraints such as enclosure, airflow, and structural limitations
- Ensure proper placement and structural integration of optical cages
Advanced Fabrication Deliverables
- Generate comprehensive manufacturing packages (Gerber, ODB++, IPC-2581)
- Define backdrilling parameters and impedance specifications
- Ensure compliance with DFM, DFA, and DFT requirements
- Support boards through fabrication, assembly, and production ramp
Library & Feasibility Ownership
- Create and maintain high-density component footprints (e.g., large BGAs, optical module connectors)
- Participate in new product feasibility studies
- Develop detailed routing guidelines and work packages for layout partners
- Review external placement and routing work to ensure quality and schedule adherence