Semiconductor Assembly Process Development Enginner

【Background / Position Overview】
We are actively advancing technological innovation in the semiconductor post‑process, with a focus on next‑generation packaging technologies such as Flip Chip and SiP.
In particular, the fields of AI, high‑performance computing (HPC), automotive, and IoT are rapidly increasing their demand for higher‑density, higher‑reliability, and high‑thermal‑dissipation package technologies. As a result, development activities for FCCSP (Flip Chip Chip Scale Package) and FCBGA are accelerating.

As semiconductor packages continue to require more complex structures and multifunctionality in the future, expanding our technical capabilities and strengthening our development organization will be essential. To support this growth, we are seeking engineers with experience in semiconductor post‑processing.

This role offers the opportunity to work on cutting‑edge technologies—such as high‑density, high‑thermal‑dissipation packages for AI/HPC and high‑reliability packages for automotive and IoT—and contribute to the development of packaging technologies that underpin innovations shaping society, including AI and autonomous driving.

【Key Responsibilities】
You will be responsible for technology development in the semiconductor post‑process, including assembly, packaging, and testing.

• Development and evaluation of advanced package technologies such as FCCSP and FCBGA
• Process development and improvement for assembly processes
  (FC bonding, solder paste printing, component mounting, reflow, flux cleaning, etc.)
• Support for production line launch and transition to mass production
• Activities to improve process quality and yield