Responsible for performing failure analysis on semiconductor devices related to assembly processes. Identify root causes of electrical and physical failures, support yield improvement, and drive improvement to enhance product quality, reliability and customer satisfaction.
Key Responsibilities
- Perform electrical and physical failure analysis on semiconductor devices related to assembly processes.
- Conduct fault isolation, decapsulation, cross-section, and defect characterization using FA tools.
- Identify failure mechanism (e.g., EOS, ESD, corrosion, delamination, metal migration).
- Analyze failing units from reliability, customer returned and abnormal yield lot.
- Prepare formal FA reports with supporting data and recommend failure phenomenon or root cause.
- Work closely with process or product engineering, and quality teams to resolve device failure issue.