Define SI/PI requirements based on IP and system-level specifications.
Perform SI/PI simulations at electromagnetic (EM), circuit, and system levels.
Develop SI/PI methodologies for advanced packaging technologies such as chiplet, 3D-IC, D2D (die-to-die), and C2C (chip-to-chip) interfaces.
Cover SI/PI analysis and optimization at the full system level, including on-chip, package, and PCB domains.
Provide design guidance on stack-up, interconnect routing, PDN architecture, decoupling strategy, and component selection.
Collaborate with silicon, package, and board teams to ensure accurate measurement-simulation correlation and system-level robustness.
Support debug and bring-up efforts in the lab when needed.
Work with internal teams and partners to co-optimize SI/PI solutions.
BS or MS in Electrical Engineering, Physics, or a related field.
8+ years of experience in component- and system-level SI/PI analysis.
Solid understanding of SI/PI fundamentals and methodologies.
Hands-on experience with lab instruments such as VNA, TDR, and real-time oscilloscopes.
Proficient in EDA tools such as SIwave, HFSS, ADS, HSPICE, Allegro, RedHwak-SC, SC-ET, or RedHawk-3DIC.
PhD in Electrical Engineering, Physics, or a related field with 5+ years of relevant industry experience.
Candidates with one or more of the following experiences will be given strong consideration:
SI/PI analysis and optimization for high-speed digital systems and standard interfaces (e.g., PCIe, DDR, Ethernet)
Model and analyze complex 3D structures using EM simulation tools
On-chip Backend sign-off (Static/Dynamic IR, EM)
On-/Off-chip PDN modeling and budgeting
On-chip glitch/jitter/DVD analysis and sign-off methodology, including cross-talk, TSV uncertainty, and multi-corner/process derating
Early-stage reference clock jitter estimation and sign-off methodology development
Experience with on-chip clock sign-off, including clock design guide, 3DIC jitter derating, and multi-corner/process variation analysis.
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