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As part of WW ASIC product development team, this individual will work closely with silicon & package design, marketing, NPI, assembly/substrate suppliers & customers and is responsible for developing cost effective high performance, advanced custom package solutions achieving signal integrity, thermal, structural reliability, substrate fab/package assembly design rules & project schedule requirements. ā¢2.5D & 3D is cutting edge package technology with BRCMās needs pushing the technology limits.
Job Scope (Advanced Package Technology Engineer)
āProvide deeper expertise in 2.5D / 3D technology; current and future customer engagement on technology needs & updates, consolidation of requirements and drive towards unified solution.
āLead in identification, development& qualification; program managementwith external assembly partners
āLead in memory supplier(s) engagement to define technology and quality requirements.
āInterface with other technical teams (DI, Pkg Design, Test Dev) etc. as part of Cross Functional Team.
āSupport new design wins, NPI and volume ramps.
āDevelop alternate sourcing & qualification.
Basic: Master's Degree in Mechanical / Electrical / Electronics Engineering with 6+ years of relevant experience in developing cost effective, high performance (speed, density, pin count, thermal & reliable), single & multi-chip, large, complex, custom &fine pitch flip chip packaging solution with advanced multi-layer ceramic / organic substrates & Interposers; Standard & thermally enhanced fine pitch leaded & BGA wire bond & wafer level packaging solution; or PhD with 3+ years of relevant experience
Specific: 4~6 years Hands On experience in 2.5D / 3D Development;In-depth Know-how of Advanced Silicon fab, Bump, Interposer, substrate & assembly processes, materials & supplier selection, BOM definition, thermal and mechanical interactions.
Others:
āSound knowledge of & hands on experience in advanced, prevailing and emerging silicon, package & substrate technologies, bumping and assembly processes, design rules, failure analysis tools and techniques, materials and equipment, applicable industry standards, regulations & quality systems.
āGood team player with project management, analytical, problem-solving and interpersonal skills. Must be self-driven, flexible and agile, result oriented individual. Ability to develop concepts into structured projects, generate new and innovative solutions to complex problems and handle multiple programs concurrently.
āHands-on experience ofuse of modelling (Thermal & Mechanical) & Sub / PCB Design CAD tools (APD, AutoCAD, Solidworksetc) for design optimization.
āSound knowledge of advanced node silicon fabrication, PCB technologies and board assembly processes, applicable industry standards, quality systems and regulations.
āCommunicate extensively with internal and external team members, customers in various global locations and may require travel from time to time.
Additional Job Description:
Compensation and Benefits
The annual base salary range for this position is $120,000Ā Ā - $192,000
This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.
Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.
Broadcom is proud to be an equal opportunity employer. Ā We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. Ā We will also consider qualified applicants with arrest and conviction records consistent with local law.
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