Who We Are
Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world.
What We Offer
Salary:
$176,000.00 - $242,000.00Location:
Santa Clara,CAYou’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more.
At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits.
Key Responsibilities:
Process Integration & Development: Define, develop, andoptimizeadvanced packaging process flows (e.g., TSV, RDL, bump, hybrid bonding, die stacking).
Cross-Functional Collaboration: Lead technical projects to integrate packaging needs into product designs, ensuring Design for Manufacturability (DFM) and Design for Reliability (DFR).
Design of Experiments (DOE): Plan and execute wafer-level and package-level experiments tooptimizeunit processes (dielectric deposition, plating, etching, CMP, bonding).
Yield & Failure Analysis: Analyze electrical, physical, and defect data to root-cause yield limiters and implement corrective actions.
Vendor Management: Collaborate with OSATs and substrate manufacturers to define equipment/material roadmaps, track NPI (New Product Introduction), and ensure ramp-up readiness.
Technical Leadership: Proactivelyidentifyand mitigate risks related to silicon-to-package interaction (SPI), warpage, and thermal management
Leadadvanced packagingprocess integrationfor high performance interconnectandmicroLEDpanel.The job requires providing solutions that are highlycreative, anddirectly contribute to product differentiation.Will beresponsibleto establishintegration flow withmanufacturability and reliability. Work closely withfab, assembly, substrate, connector partners,andcollaborate with multi-functional teams withinAppliedandexternal partners
Teams up with Design & Engineering modules (design,process,packaging, metrologyteams)todeliver successful products
Teams up with Product Marketing to understand the Product Marketing plans, and Product Roadmap
Additional Information
Time Type:
Full timeEmployee Type:
Assignee / RegularTravel:
Yes, 10% of the TimeRelocation Eligible:
YesThe salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable.
For all sales roles, the posted salary range is the Target Total Cash (TTC) range for the role, which is the sum of base salary and target bonus amount at 100% goal achievement.
Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.
In addition, Applied endeavors to make our careers site accessible to all users. If you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at Accommodations_Program@amat.com, or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor. This contact is for accommodation requests only and cannot be used to inquire about the status of applications.
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