Key Responsibilities:
• Lead hardware design and development for ADAS, Cockpit, and Connectivity ECUs, from concept to production
• Design high-speed digital boards with advanced SoCs, DDR4/DDR5, LPDDR interfaces, PCIe, Ethernet (RGMII/SGMII/RMII/10G), USB, MIPI CSI/DSI, and SerDes.
• Perform schematic design, component selection, and BOM optimization ensuring automotive-grade reliability and cost efficiency.
• Conduct Signal Integrity (SI) and Power Integrity (PI) analysis for critical high-speed signals and power rails.
• Support thermal design and validation, collaborating with mechanical and thermal engineers to ensure performance under harsh automotive conditions.
• Ensure ASIL-D compliance (ISO 26262) for safety-critical designs; participate in FMEA, FMEDA, and safety architecture reviews.
• Interface with camera, radar, LiDAR, and sensor fusion modules, ensuring signal quality, timing, and synchronization.
• Collaborate with PCB layout engineers for constraint-driven designs (impedance, stackup, crosstalk, EMI/EMC).
• Drive hardware validation and bring-up, including board-level testing, debugging, and root-cause analysis.
• Work with cross-functional teams (System, Software, Validation, Manufacturing, EMC) through design verification and PPAP stages.
• Support DFMEA, DFx (DFM, DFT, DFA) activities to ensure manufacturability and reliability.
• Create design documentation, validation reports, and participate in technical reviews and customer discussions.
• Required Skills and Experience:
• Bachelor’s or Master’s Degree in Electronics, Electrical, or related engineering field.
• 5–9 years of hands-on experience in automotive hardware design.
• Proven experience with SoC-based board design (e.g., NVIDIA, Qualcomm, Renesas, TI, NXP, Infineon AURIX).
• Strong understanding of ADAS, Cockpit, and IVI architecture including sensor and compute domains.
• Expertise in high-speed design (DDR4/5, PCIe, MIPI, Ethernet, USB 3.x, LVDS, SerDes).
• Experience with SI/PI analysis tools (e.g., HyperLynx, Sigrity, Ansys, Cadence). • Knowledge of Automotive Safety (ISO 26262 – ASIL B to D compliance).
• Familiarity with EMI/EMC standards (CISPR 25, ISO 11452) and compliance testing.
• Understanding of thermal design, power sequencing, and power distribution.
• Experience in camera/radar interface and sensor fusion hardware design.
• Proficiency in schematic tools (Altium, Cadence Allegro, Mentor DxDesigner, Zuken CR8000).
• Hands-on experience with hardware bring-up, debugging, and lab instruments (oscilloscope, logic analyzer, power analyzer, etc.).
• Excellent analytical, communication, and documentation skills.
• Preferred Qualifications: • Experience with ASIL-D compliant ECU development.
• Exposure to Ethernet TSN, CAN-FD, LIN, FlexRay and in-vehicle communication networks.
• Knowledge of thermal simulation and mechanical integration.
• Familiarity with AI/ML accelerator SoCs used in perception and fusion ECUs.
• Experience working with global OEMs and Tier-1s on production projects.
• Key Tools & Technologies: • Schematic/PCB: Zuken , Altium Designer, Cadence Allegro, Mentor Graphics
• Simulation: HyperLynx, Ansys SIwave, Sigrity, SPICE, ADS
• Compliance & Debug: Oscilloscope (≥20GHz), Vector CANoe, Power Analyzer, JTAG
• Documentation: PDM/PLM systems, Jira, Confluenc