Modern automotive systems operate at data rates exceeding 16 Gb/s, where small variations in PCB materials can significantly affect signal integrity. One important effect is resin skew, caused by the inhomogeneous distribution of glass fibers and resin in PCB laminates. Differential signals propagating over glass bundles versus resin pockets experience different propagation velocities, leading to timing skew and potential eye-diagram degradation.
This internship investigates measurement-based characterization of resin skew using dedicated high-speed PCB test structures. The goal is to design, simulate, and analyze differential test structures that allow quantifying skew induced by glass weave and resin distribution. The work contributes to developing standardized measurement structures for reliable high-speed interconnect design and material selection.