Academic Internship in Mechanical Engineering (f/m/div.)

Your contribution to something big:

- Project Background:

1. One of the first steps in obtaining an electronics product is correct design and manufacturing of Printed Circuit Boards assemblies (PCBa). This is where our section is positioned, in developing the technologies thar allow us to manufacture PCB Assemblies.
2. In a fast moving and highly competitive market, being fast and efficient is the answer. Simulation plays a big role in today's industry. By creating digital twins for manufacturing processes we shoot for that effectiveness. These are based on simulation models for each process with inputs closely replicating machine parameters and raw material geometry and physical properties. As for outputs they allow to forecast the quality and probability of defects on a given PCBa. The more accurate the inputs and simulation strategy the higher is the quality outcome of the simulation. This project aims on increasing model accuracy by investigating both material properties and simulation strategies.  

- Research Objectives:

1. Understand the physical phenomena behind reflow soldering process.
2. Research and characterize relevant material properties.
3. Investigate state of the art simulation methodologies
4. Simulation Model Development/Improvement.
5. Implement automation strategies for simulation models (Python Based)

    
- Proposed Study Plan:

1. Literature Review 
2. Productive Processes familiarization physical characterization
3. Material Characterization (experimental and analytical)
4. Familiarization and on-the-job training with simulation software (Ansys)
5. Simulation Model Development
6. Simulation Model Validation 
7. Discussion & Thesis Writing