Your contribution to something big:
- Background / Current situation:
- SIP (System in Packages) modules becoming widely used at Bosch in different products. This technology presents a higher complexity, compared to the standard BGA packages due to the large sizes, and CTE mismatch activated at high temperatures. These special characteristics are leading to new failure modes caused by different failure mechanisms, not deeply studied so far, such as, pad cratering, non-wetting, hot tear, etc.
- Scope:
- Understand the failure mechanisms caused by thermal-mechanical loads;
- Understand the interactions between different material/design combinations;
- Understand the manufacturing impact (process parameters - special focus on reflow process);
- Creation of design rules for SIP components capable to mitigate these failure mechanisms;
- Simulation tools to support on the load path effect.
- Test Planning Proposal:
- Literature and Bosch SIP documents review;
- Data collection from different Bosch Plants;
- Use of MBE model (Model Based Engineering) for a comprehensive study on thermal-mechanical mecanisms and influence of design parameters;
- Propose of design elements and manufacturing solutions based on previous investigations;
- Use of simulation tools to predict and support design decision.